TP980 High-Frequency PCB with 7.62mm Thick Core and ENIG Finish for Aerospace Applications
1.Product Introduction: Revolutionary Thermoplastic RF Material
The TP980 represents a breakthrough in high-frequency circuit materials, utilizing a proprietary ceramic-polyphenylene oxide (PPO) composite without traditional fiberglass reinforcement. This innovative thermoplastic formulation enables precise dielectric constant adjustment from 3.0 to 25 through ceramic/PPO ratio control, with the TP980 variant optimized at 9.8±0.2 Dk. Unlike conventional laminates, the TP series offers three configurations: bare substrate (TP), single-clad (TP-1), and double-clad (TP-2) versions for design flexibility.
2.Key Material Properties (TP980)
Precision Dielectric Constant: 9.8±0.2 @10GHz (adjustable 3.0-25 range)
Ultra-Low Signal Loss: 0.0012 dissipation factor @10GHz
Temperature Stability: -40 ppm/°C ΔDk (-55°C to 150°C)
Thermal Management: 0.65 W/mK conductivity
3.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | TP980 |
| Layer Count | Double Sided |
| Board Dimensions | 185mm × 185mm (±0.15mm) |
| Minimum Trace/Space | 6/6 mils |
| Minimum Hole Size | 0.8mm |
| Blind Vias | No |
| Finished Thickness | 7.7mm |
| Copper Weight | 1oz (35μm) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | ENIG |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
4.PCB Stackup: 2-layer rigid PCB
Copper layer 1 - 35 μm
TF980 Core - 7.62 mm (300mil)
Copper layer 2 - 35 μmμm
5.Board Statistics
Components: 10
Total Pads: 31
Thru Hole Pads: 21
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 22
Nets: 2
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Technical Advantages
Fiberglass-Free Design: Eliminates weave effect for consistent RF performance
Military-Grade Reliability: Withstands extreme thermal cycling
Manufacturing Flexibility: Compatible with standard PCB processes
Custom Dk Options: Available in 11 standard variants (TP300-TP980)
8.Target Applications
Global Satellite Navigation System
missile-borne,
fuze technology
miniaturized antenna